Multilayer electronic circuit inkjet 3D prototyping system P2-3DEE
Multi-layer Circuit Board 3D Inkjet Solution
Based on high-performance nano-conductive ink and insulating structural ink, the two electronic functional inks are printed and stacked layer by layer in a stacking order; the built-in optical sintering and curing module realizes the integration of printing and sintering.
The structure and electronic functions are integrated! It has pioneered the transformation of 3D printing from structural molding to function. Digital inkjet has the characteristics of high throughput of array nozzles, and the efficiency can be greatly improved through the combination of nozzles. In addition to traditional electronic structures, it can also meet the preparation of special-shaped structures and embedded structures, and realize array and batch manufacturing.
APPLICATIONS
● 3D printing for electronic engineering
● Special-shaped and complex structure circuits
● Embedded circuits
● Preparation of multi-layer circuit boards and multi-layer devices
● Conformal circuits
● Flexible circuits and flexible electronic devices
● Special RF antennas, radar antennas
● High-temperature circuits (ceramics, glass, silicon, etc.)
● Printing and preparation of LTCC circuits
● Preparation of various device circuit electrodes
CHARACTERISTICS
● Preparation of multi-layer, special-shaped, and complex structure circuit boards
● "One-click" multi-layer continuous printing
● Printing and sintering integration
● In-situ photon sintering
● Support CCD alignment overprinting
● Multi-layer Gerber circuit file import, BMP import
● Slice file import such as stl/3mf/obj/3ds
● Edge thinning function to balance ink diffusion
● Automatic moisturizing and cleaning system
● Thermal management system such as sintering and printhead temperature control
FIELDS
● Aerospace
● National defense and military industry
● Medical electronics and wearable electronics
● Corporate R&D centers, accelerated development
● Academic and research fields
● Automotive industry
● Circuit board production
● Semiconductor devices LTCC/MTCC
● Touch screens, etc.
Integrated structure and electronic function!
Pioneering the transformation of 3D printing from structure to function!
"Remote control", "Industrial Internet"
"Smart Manufacturing", "Lightless Factory"
3D Additive Manufacturing of Electronic Circuits
BroadTeko is a supplier of digital inkjet additive manufacturing electronic product materials and intelligent machine solutions. The company has long focused on digital material patterning technology. Based on the innovation of advanced optoelectronic materials, it has developed digital micro-nano material patterning technology to replace and eliminate traditional analog/template material patterning technology, helping optoelectronic materials enter a new era of digital patterning. BroadTeko has become a leader in digital patterning of optoelectronic materials.
Array and Batch Preparation
Preparation of special-shaped structures and embedded structures
Key features