PRODUCTS
Application Cases
- 3D Electronics and Circuits
- 3D Electronics and Circuits
- 3D Electronics and Circuits
- 3D Electronics and Circuits
- 3D Electronics and Circuits
- 3D Electronics and Circuits
- 3D Electronics and Circuits
- 3D电子-结构电路
Digital inkjet manufacturing with integrated structure and electronic functions
Multi-layer Circuit Board 3D Inkjet Solution
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It has pioneered the transformation of 3D printing from structural molding to functionalization. Digital inkjet has the characteristics of high throughput of array nozzles, and the efficiency can be greatly improved through the combination of nozzles. In addition to traditional electronic structures, it can also meet the preparation of special-shaped structures and embedded structures, and realize array and batch manufacturing.
MATERIALS
Electronic materials + Digital material deposition
Conductive materials + Digital materials deposition = breaking the design constraints of electronic circuits
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Combining innovative design concepts and analysis methods, through the application and development of electronic materials and their digital molding technology, personalized molding of any circuit layer is achieved, and multi-layer continuous digital inkjet molding is used to obtain special structure electronic circuit boards.
NEWS
Regarding the application of inkjet manufacturing technology in the optoelectronic field, 3D electronics, flexible electronics, embedded electronics and in-mold electronics, as well as its application in circuit boards, OLED/QLED display lighting, Mini-led/Micro-led, photovoltaics, semiconductors, components and bioelectronics and other industrial fields.
Beijing BroadTeko Technology Co., Ltd. www.BroadTeko.com, Address: No. 45, Yanqi East 2nd Road, Yanqi Economic Development Zone, Huairou District, Beijing